manufactures and distributes all types grinding / polishing machines from 3" to
15" platen for research laboratories in martial engineering, semiconductor
failure analysis, precision optics and lapidary hobbyists. If you have any need
for polishing machine, please call our expert at 02-868-0661 to find a cost-effective
solution. We always keep standard grinding / polishing machines and related
accessories in stock for immediate delivery, please choose and order them from
below: e-mail: pcb21@korea.com
Unipo300 Mini (3")
Automatic Grinder/ Polisher with Complete Accessories
Unipo300 Mini (3")
Automatic Grinder/ Polisher with Complete Accessories
Detailed Description
Unipo300 is a automatic mini-grinder / polisher for
preparing TEM, metallography, and substrate samples in a single mount. The
machine equips with many advanced features, such as 3" fix lapping
plate, variable sample moving speed, adjustable pressure load and selectable
time switch to achieve attention free polishing. Unipol 300 simulates human hand
to grind and polish sample via randomly moving sample holder on top versus fixed
3" plate. It is very suitable for preparing < 1" dia specimen in low
volume laboratory for material research, failure analysis and medical test. By
combining our DSYJ-150 low speed saw, you can own a
processing lab on one desk to prepare
versatile specimen at affordable budget.
Features:
Easy to use and affordable price.
Variable moving speed for the sample
holder on top
Adjustable pressure load by a spring
inside from 0 - 5 Newtons
Automatic timer setting from 0 to 99
hours
One rubber polishing bowl with one 3"
glass lapping plates are included
Extra rubber bowl and 3" glass lapping
plate are available as option.
Two 1" dia. sample holders are
included
one for flat sample as shown inside
plate in the picture left
Another holder for inserting bulk
sample as shown on top machine.
Compressing or cold mount sample can
be used as sample holder ( make a hole in round sample mount ceneter, put movong
rod on the hole )
Power: AC 110V and 220V selectable
for worldwide operation.
Max. moving weight of specimen: 200g
Max. sample size: 25 mm dia. x 20
mm H
Overall dimension: 420mm L x 190mm W x
210mm H.
Net Weight: 24 lbs
Package dimension: 18" x 11" x
9"
Shipping weight: 32
lbs
3" glass lapping plate (
front & back )
Standard Package Included in
the Unipol 300 Grinder / Polisher
P/N
Item
Name
DUP-300-01
Unipol 300 Grinding / Polishing
Machine
DUP-300-02
Rubber polishing bowl
DUP-300-03
3" glass lapping plate
DUP-300-04
1" dia. sample holder for flat
sample
DUP-300-05
1" dia. sample holder for inserting
bulk sample
DUP-300-06
AC power cord
DUP-300-07
Operation manual
DUP-300-07
1
set of 3 syringes (10g) diamond paste with
0.25, 1.0, and 3.0 micron grit
Unipo830 Heavy Duty Belt
driven 8" Grinder / Polisher with Magnetic Plates & Complete Accessories
Unipo830 Heavy Duty Belt
driven 8" Grinder / Polisher with Complete Accessories
Detailed Description
Unipo830 Heavy Duty Belt Driven 8" Grinder /
Polisher
UNIPOL- 830 is heavy duty 8" grinder /
polisher with belt driven and quiet operation. It comes with magnetic disk and
complete accessories and allow user to change grinding / plishing plates at
quick and easy. It is ideal tool for preparing matellurgraphic sampel
manually
Features
Heavy duty fiberglass case with
anti corrosion painting surface.
Belt driven 8" platen with high
torgue, which is much stable than Unipo800
Power: 110V or 220 V
switchable power supply, worldwide support
Motor: 300W DC motor
with belt pulley
Variable speed: from
0 - 600 RPM with digital display for each plate
8" Aluminum lapping plates can
be quickly released and installed.
Soft rubber splash guard for safe
operation
Dimension: 490mm
x350mm x250mm
Aprox. net weight: 36
Kg
Complete accessories included for
immedate use ( > value )
One Aluminum alloy master
plate 8" dia lapping plate
One 8" dia.x 0.8 mm thick permanent magnetic sheet with
PSA backing ( installed
in Aluminum plate )
One8" dia. Diamond Lapping plates with 320 mesh and 600mesh
separately(without
PSA, can be attach to
mangnetic plate directly )
Two8" dia x 0.7mm
thick steel buffer sheet (Zinc coated) for carrying sand paper and polishing
pad, which can be attached to magnetic plate at stable and take off at
easy
Fourpacs 8" Sic sand papers ( 2 of each at mesh of
240#, 400# , 800# ,1500# )
One 8"
PSA black polishing pads for final polishing
One10g 1.0
micron diamond paste for faster polishing
Shipping package dimension:
Shipping weight
: 95 lbs
Unipo820 Heavy Duty ( 8")
Dual Platens Grinder/ Polisher with Magnetic Plates & Complete Accessories
Unipo820 Heavy Duty ( 8")
Dual Platens Grinding / Polishing Machine with Magnetic Plates & Complete
Accessories
Detailed Description
Unipo820 Dual Plates
8" Grinding / Polishing Machine with Magnetic
Plates and Complete Accessories
UNIPOL-820
is heavy duty grinding / polishing machine with two 8" lapping plates and
independent speed control. Upgraded magnetic plates were installed in the
machine, which make install sand paper / polishing pad quicklt and easily.
UNIPOL-820 is perfect for metallographic lab to prepare small sample faster and
easier
Features :
Heavy duty fiberglass case with anti
corrosion painting surface
Belt driven platen with stable and
quiet operation
Power: 110V or 220 V
switchable power supply, worldwide support
Motor: Two 300W high torque
DC motor with belt pulley with independent speed control
Variable speed: from 0 -
600 RPM with digital display for each plate
Two 8" Aluminum lapping plates can be
quickly released and installed.
Soft rubber splash guard ring for safe
operation
Dimension: 580 L
x 420 W X 350 H (mm)
Aprox. net weight: 44
Kg
Complete accessories included for
immedate use ( > value )
Two Aluminum alloy master
plate 8" dia lapping plate
Two 8" dia.x 0.8 mm
thick permanent magnetic sheet with PSA backing ( installed
in Aluminum plate )
Two8" dia. Diamond Lapping plates with 320 mesh and 600 mesh
separately(without
PSA, can be attach to
mangnetic plate directly )
Four8" dia x 0.7mm
thick steel buffer sheet (Zinc coated) for carrying sand paper and polishing
pad, which can be attached to magnetic plate at stable and take off at
easy
Eightpacs 8" Sic sand papers ( 2 of each at mesh of
240#, 400# , 800# ,1500# )
Two8"
PSA black polishing pads for final polishing
One10g 0.25 micron diamond
paste for faster polishing
Unipo800 Econnomic 8" Grinder / Polishing Machine with
Complete Accessories
Unipo800 is a complete
grinding and polishing machine which is designed for material research
laboratory with affordable price for researchers and graduate students.
The 5-step diamond accessory kit ( value ) makes it possible to grind,
shape and polish all types of materials, such as glass, quartz, ceramic and
metallic sample . Unipol 800 is quiet and easy to clean up. It includes all necessary diamaond accessories and let you work
immediately.
Standard
Package
Coolant reservoir ( top black) with
valve and drain container ( botton black) are included for operating machine
everywhere.
Five disc backing plates (
Master plate)
Four PSA Diamond lapping plates at
vaious mesh ( clcik underline to see specs and cost for replacement )
One 320 mesh PSA
plate
One 600 mesh PSA
plate
One 1200 mesh PSA
plate
One 1800 mesh PSA
plate
Two Black PSA polish pad for
final polishing
One 10 g 0.25 microm diamond
compound for final polishing
Complete Instructions
Specifications
Motor:
1/4 HP equivalent Ball Bearing
DC
Voltage:
115V AC (220V AC as option at extra
cost)
Speed:
500 to 3,000 rpm
Drive:
Direct Drive on 2"
Flange
Dimensions:
12" x 12" x 7"
Weight:
18 lbs. including
accessories
Shipping Dimensions:
18" x 20" x 15"
Shipping Weight:
30
lbs.
Coolant reservoir on the top allows to operate
in everywhere
Take off splash guard - Easy to clean
the polisher
UNIPO801 polishing machine is equipped with 8" super flat
Aluminum lapping plate and one york sample support, as well as
complete diamond lapping accessories. It can be used as a standard
manual grinder, or automatic lapping / polishing machine for both of flat sample
and metallurgraphic samples. It is the most cost effective solution for
material research lab.
Features
:
Heavy duty cast aluminum case with beautiful painting
surface .
Beldrive with hig htroque and quiet
operation
8" dia Super flat lapping plate (
Steel)
Condition ring with one 75 mm
dia flat sample holder for lapping polishing flat component.
3" dia. flat sample holder for
polishing flat sample
75 mm dia. sample holder with
three holes to allow polishing three metallurgraphic samples up to 1" dia. at
one time , which is available as optional
Two dead weights to increase
polishing pressure.
York supporter to allow
polishing automatically
Complete accessories for grinding,
lapping and polishing, including:
Two 8 " PSA Diamond Lapping plates
with 320 mesh and 600 mesh separately for fast lapping/grinding
Two 8 " PSA polishing pads for
final polishing
10g 0.5 micron diamond paste for
faster polishing
Specifications
Power: 120V or 240 V selectable via a
switch Motor: 0.25 KW high torque DC motor with
one year warranty Variable
speed: from 0 - 600 RPM Dimension: 525 L x 350 W X325 H
(mm) Aprox. net weight: 30
Kg
Unipo802 (8" ) Precision
Auto Lapping and Polishing Machine with two work stations
Unipo802 (8" ) Precision
Auto Lapping and Polishing Machine with two work stations
Detailed Description
UNIPO802 machine is
equipped with 8" super flat lapping plate and can be used as a high precision
lapping machine for polishing crystal components, semiconductor
wafers, and ceramic substrates up to 3" in diameter. It can be used as a
standard grinding and polishing machine for preparing metallographic samples as
well. Combining with flat sample holder (included), three hole metallographic
sample holder (optional ), and precision thinning fixture ( optional), Unipol
802 can lap and polish various samples
automatically.
Features:
Precision rotating shaft
with running off < 5 micron
Two super flat lapping
plate with flatness < 2.5 micron / Inch2
one cast iron plate for lapping
and one cast aluminum plate for polishing
Heavy duty cast aluminum case
with bright painting
Two rocking work stations
with wafer holders and condition rings can be controlled independently for polishing 2 pcs of 3" wafers in one
running
Variable speed from 0 to 125 RPM
with digital display
Adjustable timer for auto-stop
up to 99 hours
As optional
parts auto slurry feeder and precision polishing fixture are available for
polishing automatically
Typical
Specifications
Super-Flat 8" Lapping
Plate
Flatness < 2.5 micron /
inch2
Precision Rotating Shaft
Running Off < 5
micron
Heavy Duty Cast Aluminum Case with
Painting
Color : Black
Two Work Stations
with 80 Rocking and adjustable speed
0 - 20 rocking /
minute
Two flat sample holders for carring
< 3" diameter wafer
80 Dia. x 35 T
mm
Two Condition Rings
95 O.D. x 88 I.D. x 32 T mm
Variable Speed of Master Plate with
Digital Display
0 ~ 125 rpm
Adjustable Timer for Auto-Stop
0 - 99 hours
Automatic Slurry
Feeder
Optional for automatic polishing
Power
120V or 240 V selectable via switch
Motor
300 W high torque DC
motor
Dimension
525 L x 350 W x 325 H
(mm)
Weight (without
packing)
120 lbs
Warranty
one year
Package
Dimension
40" x 38" x 30"
Shipping Weight
160
lb
Standard
Package:
P/N
Item
name
DUP802-01
DUnipo802 Polishing
Machine
DUP802-02
8" Cast Iron Polishing
Plate with Machine
DUP802-03
8" Cast Aluminum
Polishing Plate
DUP802-04
Condition
Ring
DUP802-05
3" Sample Flat
Holder
DUP802-06
8" Polyamide Foam
Polishing Pad
DUP802-07
8" Poromeric Polishing
Pad (PSB)
DUP802-08
Screw
Drivers
DUP802-09
Power
Core
DUP802-10
Operation Manual
Optional
Parts:
P/N
Item name
UPO802-11
SKZD-2 Automatic Slurry Feeder
PF-2-1
2" Polishing Fixture for Precision / Automatic Thinning and
Polishing
PF-3H1W2
Polishing Sample Holder with Three 1" Holes for
Metallurgraphy
Unipo1000 (10" )
Precision Auto Polishing Machine with 6" Power Head
Unipo1000 (10" ) Precision
Auto Polishing Machine with 6" Power Head
Detailed Description
UNIPO1000
is designed for preparing metallurgraphic, ceramic and optical sample
faster / better. It equiped with 10" dia mater plate and pressure adjustable
rotation head and can polish multi samples in one time.
Features:
Touch pad switches control
polishuing time and speed
Variable Platen speed from 50 - 600
RPM with didgital display
Variable power head platen speed
between 0-100 RPM
Adjustable power head force between
1- 200 N
Variable cycle time from 0 - 999
seconds
Two sets of sample platens (6"
Diameter) are included which can be changed quickly
One platen for polishing flat
sample, which can mount 7 pcs 2" wafers on one plate
One holder plate has 6 holes ( 1"
diameter) , which can mount 1" diameter or less samples upto 6
pcs
coolant or slurry feed system are
built in with control valve
Polishing program can be set up in
the front panel ( polishing time ) and make polishing procedure consistent in
every running.
Two years limited
warranty
Main
Specifications
DC Motor Power:
1.5KW
Input Power:
208 - 240V AC single phase, 50-60 Hz.
Mater Lapping plate: 10"
( 250 mm ) diameter
Polishing time set- up: 0 -
999 seconds
Sample Holder Head: 6"
diameter
Head pressure: 1
- 200 N
Overall Dimension:
660x380x640mm
Net Weight:
45 kg ( 100 lb)
Shipping dimension 40"
x 38" x 42"
Shipping
weight 72.5 kg ( 160 Lb)
Package and
accessories
One 10" cast Alunimum lapping
plate
Two sample holder heads
Ten pcs SiC abbrasive sand
papers
One water pipe for draining
water
2" Polishing Fixture for
Precision / Automatic Thinning and Polishing
2" Polishing Fixture for
precision Thinning and Polishing
Detailed Description
Features:
Precision Polishing Jig
for accurate wafer / substrate polishing and backthining
2" Diameter sample holder
to take wafer or substrate up to 2"
Thickness control screw
fixture with resolution of 0.005 mm to limit stock remove
Two micrometers are
including with resolution of +/- 1 microm for more accurate controll polishing
remove
Two dead weighs are
included for adjusting polishing gravity
This Polishing fixture can
fit with Unipol801, Unipol802 and any precision 8" polishing machine with York
support to achieve automatic polishing or thining.
Excellent for reparation of TEM sample
and IC section analysis and Flat single crystal
substrates
Unipo1210 Heavy Duty (
12") Precision Grinding / Polishing Machine with Magnetic Plate & Complete
Accessoies
Unipo1210 Heavy Duty ( 12")
Precision Grinding / Polishing Machine with Magnetic Plate & Complete
Accessoies
Detailed Description
Unipo1210 Heavy Duty 12" Grinding / Polishing Machine with Magnetic Plate & Complete
Accesories
UNIPOL- 1210 grinding / polishing
machine is equipped with 12" Magnetic lapping plate
and complate accessories, including steel buffer sheet, sand paper, polishing
pad, diamond lapping plate and diamond paste for immediate use. The upgraded magnetic plate technology allows
you install and take off sand paer and polishing pad quickly and easily.
UNIPOl-1210 can be used as a standard manual grinder, or lapping / polishing
machine for both of flat sample and metallographic samples. It is the most cost
effective solution for material research lab to prepare metallographic samples
and failure analysis
Features
:
Heavy duty steel case
with beautiful painting surface.
Power:
120V or 240 V auto switching power supply, worldwide support
Motor:
300W high torque DC motor with one year warranty
Variable
speed: from 0 - 600 RPM with digital display
Emergency
Stop Front Power Switch for easy stop
Dimension:
560 L x 345 W X 325 H (mm)
Aprox. net
weight: 42 Kg
Dimension of
shipment: 36" x 30" x 22"
Weight of
shipment: 140 Lbs
12" dia Aluminum alloy
lapping plate is pre-installed with permanent magnetic sheet and allows you to
attach diamond lapping plate directly with PSA , and to attach sand peper or
polishing pad via steel buffer sheet
Complete accessories
included for immediate using, including: ( > $500 value, click underlined to
order extra)
OneAluminum alloy master
plate 12" dia lapping plate
Two12" dia.x 0.8 mm
thick permanent magnetic sheet with PSA backing ( one installed in Aluminum
plate and one for replacement )
Two12" dia. Diamond Lapping plates with 320 mesh and 600 mesh
separately(without
PSA, can be attach to mangnetic plate directly )
Four12" dia x 0.7mm thick steel buffer sheet (Zinc
coated) for carrying sand paper and polishing pad, which can be attached to
magnetic plate at stable and take off at easy
Eight pacs 12" Sic sand papers ( 2 eack at mesh of 240#,
400# , 800# # 1200# )
Two12"
PSA black polishing pads for final polishing
One10g
0.5 micron diamond paste for faster polishing
Unipo1501 -polishing
machine with three fixed work stations
Detailed Description
UNIPO1501 machine
equips with 14 -15" diameter super flat lapping plate and can be used as a high
precision lapping machine for polishing crystal components, semiconductor
wafers, and ceramic substrates up to 4" diameter with three work stations. It
also can be adopted a standard grinding and polishing machine for preparing
metallographic samples. DAC provides you with cost
effective polishing machine to meet your budget and
application.
Features of Unipol
1501
Specifications of Unipol
1501
Precision rotating shaft with running off < 5
micron
Two super flat lapping plate with flatness < 0.25
micron / inch2, one cast iron plate for lapping
and one cast aluminum plate for polishing
Heavy duty cast aluminum case with bright
painting
Three fixed work station with wafer holder and condition
ring, which can polish 3 pcs of 4" wafers and 9 pcs of 2" wafers in one
running
Variable speed from 0 to 500 RPM with digital
display
Adjustable timer for auto-stop up to 99 hours
Optional auto slurry feeder
Power: 120V or 240 V selectable
Motor: 0.26 KW high torque DC motor with one year
warranty
Speed: Variable from 0 to 500 RPM with digital display
Timer: 1 minute ~ 99.99 hours
Condition ring: 140 OD x 108 ID x 25 T ( mm )
Wafer Holder: 105 Dia. x 32 T ( mm )
Dimension: 650L x 510W x 300H (mm)
Weight: 95 Kg
Package dimension: 36" x 30" x 20"
Shipping weight: 220 lbs
Unipo1202 (12" )
Precision Auto Lapping and Polishing Machine with Two 4" Work Stations,
EQUnipo1202
Unipo1202 (12" ) Precision
Auto Lapping and Polishing Machine with Two 4" Work Stations
Detailed Description
UNIPO1202
machine is equipped with 12" super flat lapping plate and can be used
as a high precision lapping machine for polishing crystal components,
semiconductor wafers, and ceramic substrates up to 4" in
diameter. It can be used as a standard grinding and polishing
machine for preparing metallographic samples as well. With combination
of polishing auxiliaries, such as flat sample holder (
included) three hole
metallographic sample holder (Optional ), precision Thinning
fixture (optional), and slurry
feeder (optional), Unipol 1202 can lap and polish various samples
automatically.
Features:
Precision rotating shaft with
running off < 5 micron
Two super flat lapping
plate with flatness < 0.25 micron / Inch2 .
One cast iron plate for
lapping and one cast aluminum plate for polishing
Heavy duty cast aluminum case
with bright painting
Two rocking work stations with
wafer holders and condition rings, which can be controlled independently for polishing 2 pcs of 4"
wafers in same time.
Variable speed from 0 to 150 RPM
with digital display
Adjustable timer for auto-stop
up to 99 hours
Auto slurry feeder is an
optinal part for polishing automatically
Typical
Specifications
Super-Flat 12" ( 300 mm) Diameter Lapping
Plate
Flatness < 0.25 micron /
inch2
Precision Rotating Shaft
Running Off < 3
micron
Heavy Duty Cast Aluminum Case with
Painting
Color : Black or
White
Two Work Stations
with 80 Rocking and adjustable speed
9 rocking / minute
Two flat sample holders for carring
< 4" dia. wafer
105 Dia. x 35 T
mm
Two Condition
Rings
120 O.D. x 110 I.D. x 32 T mm
Variable Speed of Master Plate with
Digital Display
UNIPOL1502 (15") Precision
Automatic Lapping / Polsihing Machine with Three 4" Work Stations
UNIPOL1502 (15") Precision
Lapping / Polsihing Machine with Three 4" Work Stations
Detailed Description
UNIPO1502 machine
equips with 14 -15" diameter super flat lapping plate and can be used as a high
precision lapping machine for polishing crystal components, semiconductor
wafers, and ceramic substrates up to 4" diameter with three work stations. It
also can be adopted a standard grinding and polishing machine for preparing
metallographic samples. MTI provides you with cost
effective polishing machine to meet your budget and
application.
Features of Unipo1502
Precision rotating shaft with running
off < 5 micron
Two super flat lapping
plate with flatness < 0.25 micron / Inch2
one cast iron plate for lapping
and one cast aluminum plate for polishing
Heavy duty cast aluminum case
with bright painting
Three rocking work stations with wafer
holders and condition rings.
They can be controlled
independently for polishing 3 pcs of 4" wafers or 9 pcs of 2" wafers in one
running
Variable speed from 0 to 80 RPM
with digital display
Adjustable timer for auto-stop
up to 99 hours
Auto slurry feeder is an optinal
part for polishing automatically
Specifications of
Unipo1502
Power: 120 V or 240 V selectable
Motor: 0.26 KW high torque DC motor
with one year warranty
Speed: Variable from 0 to 80 RPM with
digital display
DSYJ150 low speed diamond
saw equips with advanced digital micrometer and digital speed displaceis, it is
perfect tool for cutting / dicing / slicing all kinds of materials upto 30 mm
thickness, especially for brittle crystals, ceramics, and TEM samples. MTI has tried every effort to make the low speed diamond saw at
such high quality and low price. It makes every research lab
affordable.
Typical
Specifications
Speed range: varies from 0 -
600 rpm DC with digital display
Power: 110 and 220 AC
switchable for worldwide use.
Hight toque DC motor to allow
multi-blade cutting.
Position accuracy: 0.005mm
Max. travel distance:
25.4 mm by LCD digital micrometer ( 50 mm with adjusting sample holder)
Water-proof LCD digital micrometer with
reading of 0.001 mm and accuracy of 0.003 mm
Max wheel saw: 4" diameter
Automatic shut off: allow the
saw to run unattended.
Warranty: two
years
Package dimension: 19" x 15" x
15"
Shipping weight: 38 lbs
This is a SiC
blade: 4" x 0.35 mm x 0.5" arbor for cutting nonferrous metal materials, such as
superalloys.
This is a Al2O3
blade: 4" x 0.35 mm x 0.5" arbor for cutting ferrous metal materials, such as
iron and steel.
This is a full sintered diamond blade: 4" x
0.35 mm x 0.5" arbor for cutting crystals and ceramic
materials
모델명
DMT4 High Speed Diamond Cut-off Saw with Vise and
5 pcs 4" diamond blades
Manual
4" Diamond High Speed Cut-off Saw with Vise and 5 pcs of 4"Dia x 0.35 mm x 0.5" Arbor Impregnated Diamond Cutting
Blades
Features
4" Manual Cut-off Saw is the perfect tool for
quickly cutting valuable materials, such crystal rough, ceramic, metal rod and
almost any material before lapping and polishing.
The saw table is flat so it is easy to trim
oversized slabs and removable so clean up is easy. The sturdy table measures
6" X 10", easy to operate.
The saw housing is made of unbreakable cross-linked
polyethylene - No Rusting, No messy oil, uses water only.
The 1/4 HP equivalent variable speed ball bearing
direct drive motor allows the saw to run fast enough to use ultra thin diamond
blades and it is powerful enough for impregnated diamond blades. Speed varies
from 400 -3250 RPM
Max. cutting depth: 1" (25.4 mm)
Comes with 5 pcs of
impregnated diamond blade of 4" Dia x 0.014" (0.35 mm ) thickness x 1/2" arbor, as
well as a vise which allow you keep sample smoothly.
Voltage: 110V
AC ( in order to use at 220-240V , you need)
Shipping dimension: 16" x 13" x 11"
Shipping weight :16lbs
Two Years limited warranty
4"Dia x 0.35 mm x 0.5"
Arbor Impregnated Diamond Cutting Blade
MP300 automatic
mounting press is used to encapsulate samples for metallographic preparation.
One mounts can be produced at one time using the mold spacer at 22 mm diameter.
The one cycle time is up to 30 minutes.
Comparison Chart of Abrasive Grade --- Choose snad paper
correctly
U.S.
Mesh
60
80
100
120
150
180
220
|
240
|
280
320
|
360
400
|
600
|
800
|
|
1200
|
|
|
|
|
|
|
European FEPA or P-Grading
|
|
|
|
|
|
60
80
|
120
|
180
|
220
280
320
360
400
500
600
800
1000
1200
|
2400
|
|
4000
|
|
|
|
|
|
|
|
|Standard
Micron Grading
|
|
|
|
|
|
|
|
260
200
160
125
100
80
68
60
52
46
40
35
30
26
22
18
15
12
10
9
6
5
Our standard diamond paste is 10 g per sringe and the competitive price
is for only purchase only. Please directly order them below and enjoy quantity
discount. If you order larger quanity ( >100 sringes) , please contact us at
pcb21@korea.com
Displaying products 1 - 11 of 11 results
TEL :
02-868-0661 (代)pcb21@korea.com
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