Silicon Wafer dicing SAW

Quality Manufacturer of High Precision Diamond Dicing Blades and Dicing Saws Committed to Customer Service Excellence

Since 1978, Thermocarbon has closely worked with its customers to solve a wide variety of dicing application problems ranging from providing the user with the optimum cutting parameters for all types of difficult materials, to recommending proper mounting and handling procedures. Our professional sales staff are constantly continuing their training within the dicing application processes so that they may better assist our customers striving to increase yield and productivity. If Thermocarbon does not have an immediate answer, we will offer you complete R&D services in our dicing lab to work toward a solution. There is never a charge for this service to you, the customer.

Blademaster® and Dicemaster® Diamond Dicing Blades

chip less run cooler last longer cut with closer tolerances than any other blade on the market Des. 381,668 & 387,364

Tcar® 864-1 Unparalleled Flexibility   .050" Thick Silicon Cut in symmetry to center artwork utilizing the patented "Wafer Zero" of the Tcar 864-1 Programmable Dicing Saw manufactured by Thermocarbon Inc. Overall cut diameter: 3.54" Process Time: 16 Minutes

Tcar® 864-1 Wafer Dicing Saw

Wafer Dicing Excellence

Whether wafer dicing thin silicon materials or cutting into heavy cross sections of hard brittle materials, such as ceramic and sapphire. Thermocarbon's wafer dicing saw and diamond grinding wheels provide dicing and diamond grinding excellence for all types of materials and applications including:

Thermocarbon backs all of its products with a complete customer support program designed to assure the maximum return on your investment. This support includes 24-hour open communications, free consultation, custom design services, sample blades, and free R&D services.

Tcar® 864-1 Wafer Dicing Saw
A Complete Turnkey System

Controls

Power and logic lockable pullout drawers facilitate easy and safe maintenance. Electronic compartments are physically isolated from all oil and water flow components via a drip pan that runs corner-to-corner between the lower and upper sections of the cabinet.

Smaller footprint

Infinite chuck rotation¹ and programming steps in addition to a four-inch "Z" travel allows for any dicing geometry. Patent-pending chuck brake system ensures solid locking of positions for high accuracy.

Possessing an excellent tactile feel, the rugged keyboard, sealed to NEMA 4, will stand up to the harshest of dicing environments.

Optics, spindle, blade, and wash bar coolant flow, as well as vacuum and air pressure, visible at a glance.

Tcar® 864-1 Wafer Dicing Saw
Standard Features

"Standard" Features means just that - no additional costs! Where options are given, simply choose which system best suits your needs for installation on your Tcar® 864-1 wafer dicing saw.

Cast iron axis construction mounted on solid Granite Block for rigidity and stability. Unique X, Y, Z, and Theta Double Closed Loop control. Unlimited Theta rotation and large four-inch "Z" travel. Powerful three horsepower variable-speed spindle. Two full color high-resolution monitors. Real time graphics display. Powerful integrated PC-based program introduces patents-pending features such as: o Flange Clearance Stop® ¹ - a patented program that prevents the collision of the blade adapter's periphery with the top surface of the workpiece during the dicing operation. o Wafer Zero® ² - Patent pending Wafer Zero® automatically transfers the home position from the chuck to the wafer center where it is needed, eliminating a very time-consuming and difficult process. o Align Offset® ³ - Patent pending "Align Offset®" (Align here/cut there) allows alignments to be made on any portion of the wafer's artwork without having to actually make a cut there. The first cut is made a specified distance from the alignment location.

The Tcar® 864-1's pop-up SmartGrafix® window simplifies creating complex shapes such as the circular optical filter shown above. The round optical filter above was diced from a rectangular glass substrate using the diverse flexibility of the Tcar® 864-1.

• Your choice of Point-and-Click High Speed or Split-Field Optic alignment systems.
  
  
• True Illumination system allows high contrast for easy viewing of gold on white or solid white ceramic substrates.
  
  
• Adjustable electronic dual cross-hair targeting system.
  
  
• Off-chuck automatic height sensing by the cut or wafer.
  
  
• Direct measurement capability in X, Y, and Theta.
  
  
• Programmable entry feed rate and overcut length control the blade as it enters the wafer and ramps up to the final feed rate.

Five sensors to protect your investment: spindle air, coolant, temperature, blade coolant, and chuck vacuum. Conductive or non-conductive dicing blades. Front panel, coolant trough, and chuck pan, made of stainless steel and powder-coated to withstand years of continuous operation. The Tcar® 864-1 wafer dicing saw offers exceptional power, accuracy, and infinite programming flexibility in a complete turnkey solution. In addition, it adheres to the three basic laws of wafer dicing hard and brittle material.

This intricate glass geometric shape, with its .065" stair width, requires a multiplicity of rotation, depth, and step-over commands. Using a single .015" thick Dicemaster® blade for the entire operation, the Tcar® 864-1 was programmed and the start button pressed.

Tcar 864-1 Technical Specifications

How the Tcar® 864-1 Wafer Dicing Saw Adheres to
The Three Basic Laws for Wafer Dicing
Hard and Brittle Materials

To be successful in dicing hard and brittle materials, the fundamental requirements of rigidity, power, and cooling must be considered for each system component selection. You also need to understand that each component of the sawing process cannot create sawing efficiency alone. Each component that makes up your interactive system must be compatible. If just one component is wrong, it could render all other properly selected components ineffective. Rigidity System rigidity plays a major role in sawing efficiency and quality, whether dicing thin silicon materials at inch-per-second feed rates, or cutting into heavy cross sections of ceramic-based materials.

A rigidly mounted spindle with virtually no end play or vibration is mandatory for dicing and diamond grinding. Additionally, to maintain the perpendicularity of the spindle to the X slide is essential for the diamond blade to run true throughout subsequent operations.

The Tcar® 864-1 wafer dicing saw is exceptionally solid in its foundation. X, Y, Z, and Theta are constructed of stable cast iron, mounted on a solid granite base and cradled into an all-steel independent frame cabinet.

Utilizing the latest technology in high precision and frictionless linear guide ways, each axis is driven using powerful DC Servo motors to ensure smooth and accurate motion in every direction.

All this, combined with Heidenhain optical encoders and the most sophisticated closed-loop feedback circuit ever designed, takes precision wafer dicing to a whole new level.

Power

The frequency inverter, utilizing 100% digital architecture, provides for variable speeds ranging from 1,000 to 30,000 RPM and maintains constant torque during acceleration. The circuit's extremely fast response time eliminates damaging power loss during the actual cutting process when dicing your most demanding applications.

Cooling

Dual nozzles provide two separate streams of coolant to the cutting interface, and at an angle to the cutting edge of the blade, so that each stream will favor one side of the diamond blade after providing the necessary coolant to the leading edge. This approach provides the necessary coolant to all of the critical areas of the cutting blade, with no loss of the directional flow required for removing the debris generated during cutting.

The Tcar® 864-1 diamond blade housing incorporates efficient dual-nozzle cooling jets that are easily adjustable in every direction to accommodate all dicing applications, no matter how thick the material is to be processed. Front-mounted flow meters facilitate easy adjustment and consistency of coolant velocities.

The Tcar® 864-1 wafer dicing saw offers exceptional power, accuracy, and infinite programming flexibility in a complete turnkey solution.

Flanges and Spacers

While most end users will take considerable steps in assuring the rigidity of the machine they purchase, they may overlook the critical mounting requirements, such as the flanges and spacers, necessary for the diamond blade. No matter how well the diamond blade was manufactured to run true, it can only run as accurately as the surfaces it comes into contact with. The bearing surfaces of the flanges or spacers must be flat, clean, and parallel.

Our Flanges and Spacers Are Designed for Longer Blade Life

The most frequent cause of blade breakage and oversize cut widths with relation to blade thickness is improper flange torque or poor flange quality. Thermocarbon's precision dicing blade flanges and spacers are constructed of the highest quality stainless steel and are also available in other materials upon request. They are machined in our own modern tool manufacturing facility to exact specifications that ensure parallelism, proper blade exposure, balance, and precise bearing surfaces. Our demanding specifications ensure:

even cut quality minimal edge chipping and kerf high dicing blade life and free cutting performance.

Maintenance and Repair for all Flanges and Spacers

Thermocarbon provides maintenance and repair for all dicing blade flanges and spacers in order to support your efforts in achieving consistent high quality standards for your wafer cutting and dicing operations.

Metal Dicing Blade Spacer

Thermocarbon also offers as a stock item the MBS-063 Metal Dicing Blade Spacer for use on desktop dicing saws using both the resinoid and metal bonded type dicing blades. The MBS-063 eliminates the need to readjust dicing blade coolant nozzles and scope positions when alternating between the two types of dicing blades.

Quality Diamond Dicing Blades for Dicing and
Precision Cutting

Thermocarbon's widely used Dicemaster® and Blademaster® diamond dicing blades have been consistently favored worldwide for their:

• precision tolerances
• self-sharpening characteristics
• consistent reliability.

Resin-bonded Diamond Dicing Blades Dicemaster® resin-bonded universal diamond dicing blades are state-of-the-art in diamond grinding technology. Dicemaster diamond blades are designed to: chip less run cooler last longer cut with closer tolerances than any other dicing blade on the market.

Highest Quality Abrasives

Self-Sharpening

High Yields

Personalized Service

In order to specifically address your individual needs, our experienced staff will help you to choose from among our various cut-off saw diamond dicing blades. Dicemaster® and Blademaster® high-quality diamond blades are available in a complete range of diameters from 2" through 4.6" to fit all dicing saws and conventional grinders. Thicknesses are available from .0015" through .2500" with various tolerance levels starting at + .0001". All blades are electrically conductive unless otherwise stated.

Specialty Configurations

Quality Diamond Dicing Blades for Dicing and
Precision Cutting

Thermocarbon's widely used Dicemaster® and Blademaster® diamond dicing blades have been consistently favored worldwide for their:

• precision tolerances
• self-sharpening characteristics
• consistent reliability.

Resin-bonded Diamond Dicing Blades Dicemaster® resin-bonded universal diamond dicing blades are state-of-the-art in diamond grinding technology. Dicemaster diamond blades are designed to: chip less run cooler last longer cut with closer tolerances than any other dicing blade on the market.

Highest Quality Abrasives

Self-Sharpening

High Yields

Personalized Service

In order to specifically address your individual needs, our experienced staff will help you to choose from among our various cut-off saw diamond dicing blades. Dicemaster® and Blademaster® high-quality diamond blades are available in a complete range of diameters from 2" through 4.6" to fit all dicing saws and conventional grinders. Thicknesses are available from .0015" through .2500" with various tolerance levels starting at + .0001". All blades are electrically conductive unless otherwise stated.

Specialty Configurations

Thermocarbon Ordering Information for
Diamond Dicing Blades

Diamond Dicing Blades

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